What is Thermal Shock Testing or Temperature Cycle Testing?

Both thermal shock testing and temperature cycle testing exposes a device under test (DUT) to alternating high and low air temperatures to accelerate failures caused due to repeated temperature variations during normal use conditions.
The transition between temperature extremes occurs very rapidly during thermal shock test, higher than 15 °C per minute. Alternatively, temperature cycle testing uses slower rates of change between high and low temperatures.
Equipment with single or multiple chambers can be utilized in performing thermal shock testing. While using single chamber thermal shock equipment, the DUT or samples will be in one chamber and the chamber air temperature is rapidly cooled and heated. This usually produces a slower rate of change in the product response temperature mainly because the entire chamber will have to be cooled down and heated up.
However larger DUT can possibly be tested in single compartment chambers. Some equipment uses separate hot and cold chambers with an elevator mechanism that transports the device under test between two or more chambers. This leads to a more rapid rate of change in the air temperature. However, there is restriction on the size and weight that can be placed inside a chamber using an elevator mechanism. To get more information visit #thermal shock testing lab.